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CVD Furnace Deposition Equipment for Semiconductor Material Preparation Thin Film

Hunan Jingtan Automation Equipment Co., LTD.
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    Buy cheap CVD Furnace Deposition Equipment for Semiconductor Material Preparation Thin Film from wholesalers
     
    Buy cheap CVD Furnace Deposition Equipment for Semiconductor Material Preparation Thin Film from wholesalers
    • Buy cheap CVD Furnace Deposition Equipment for Semiconductor Material Preparation Thin Film from wholesalers

    CVD Furnace Deposition Equipment for Semiconductor Material Preparation Thin Film

    Ask Lasest Price
    Supply Ability : 30 Piece/Pieces per Quarter
    Price : USD12,000-100,000/SET
    Brand Name : Jingtan
    Certification : CE
    Delivery Time : 60 days
    Payment Terms : L/C/T/T
    • Product Details
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    CVD Furnace Deposition Equipment for Semiconductor Material Preparation Thin Film

    Specification:
    Vacuum deposition furnace:
    Mainly used for the preparation of carbon-carbon composite materials, and the deposition furnace is mainly used for the preparation of pyrolytic carbon coating on the surface of graphite, semiconductor devices and heat-resistant scour materials.
    Parameter /Model No.
    JT-0305-C
    JT-0505-C
    JT-0608-C
    JT-0608-C
    JT-0812-C
    JT-1120-C
    JT-1218-C
    JT-1520-C
    Working Zone Size
    φ×H(mm)
    300×500
    500×500
    600×800
    600×1200
    800×1200
    1100×2000
    1200×1800
    1500×2000
    Highest Temperature
    (℃)
    2300
    2300
    2300
    2300
    2300
    2300
    2300
    2300
    Temperature uniformity(℃)
    ±5
    ±5
    ±5/±7.5
    ±7.5/±10
    ±7.5/±10
    ±10/±15
    ±10/±15
    ±15/±20
    Limit Vacuum Degree(Pa)
    1-100
    1-100
    1-100
    1-100
    1-100
    1-100
    1-100
    1-100
    Limit Vacuum Degree(Pa)
    0.67
    0.67
    0.67
    0.67
    0.67
    0.67
    0.67
    0.67
    Heating method
    Resistance/induction
    Resistance/induction
    Resistance/induction
    Resistance/induction
    Resistance/induction
    Resistance/induction
    Resistance/induction
    Resistance/induction
    CVD Furnace Deposition Equipment for Semiconductor Material Preparation Thin Film
    Design temperature
    1250℃/1650℃/1800℃/2200℃
    Common temperature
    900~1200℃
    Vacuum degree
    < 50Pa
    Pressure rise rate
    6.67pA /h(or 150Pa/24h) in cold state of empty furnace
    Heating mode
    graphite resistance heating or induction heating, independent temperature control, good temperature uniformity
    Atmosphere medium
    vacuum /CH4/C3H6/H2/N2/Ar
    CVD Furnace Deposition Equipment for Semiconductor Material Preparation Thin Film
    Gas control mode
    mass flow meter control, multi-channel gas path, uniform flow field, no deposition dead Angle, good deposition effect;Multi-stage and efficient exhaust treatment system, environmentally friendly, easy to clean up
    Furnace type
    square, round, vertical or horizontal structure (non-standard design), fully enclosed deposition chamber, good sealing effect,
    strong anti-pollution ability;
    Furnace cooling mode
    furnace shell water cooling, external circulation quick cooling system can be selected, short cooling time, high production
    efficiency;
    CVD Furnace Deposition Equipment for Semiconductor Material Preparation Thin Film
    Structure form
    horizontal - side discharge, vertical - up/down discharge
    Locking mode
    manual/automatic
    Shell material
    inner stainless steel/all stainless steel
    Insulation material
    carbon felt/graphite felt/carbon fiber cured felt
    Infrared instrument
    single colorimetric/double colorimetric
    Power supply
    KGPS/IGBT(only suitable for medium frequency heating)
    Product parameter:
    Quality CVD Furnace Deposition Equipment for Semiconductor Material Preparation Thin Film for sale
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